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Vores nye båndsav DoALL APEX-420NC er installeret og allerede i drift. Med den nye investering er vi nu i stand til at servicere kunder, der har behov for dreje- fræseemner helt op til 420mm i diameter i materialer som stål, rustfri stål, aluminium, messing, rør, mm.
Send os din forespørgsel og modtag vores uforpligtende tilbud.
aug 13 2021
Dato: 13. august 2021 07:13
Den nye altældende stregkodescanner fra Cognex, DM8700, læser de yderst vanskelige stregkoder, hvor selv DPM scannerne allerede har kastet håndklædet i ringen.
aug 13 2021
Dato: 13. august 2021 07:11
Matrix 320 - den første model i Datalogics nye generation af kraftfulde inline stregkodelæsere til både 1D og 2D koder i hurtige produktions- og lagerautomationsløsninger.
aug 13 2021
Dato: 13. august 2021 07:06
CS6080 er en solid videreudvikling af model CS4070, der nu er udgået. Afløseren er således endnu mere handy, klarer flere scanninger pr. opladning og er ikke mindst endnu mere hårdfør med sin IP64 støv-/vandbeskyttelse end forgængeren.
Zebras nye kompaktscanner kan anvendes både trådløst online og med kabel til 1D stregkoder og 2D-koder, herunder som presentation scanner.
maj 26 2021
Dato: 26. maj 2021 09:33
Following some articles related to HDI PCBs we would like to describe the three related more common build-up structures.
HDI PCB types
The design designation system of this standard recognizes industry approved design types used in the manufacture of HDI printed boards. The designations determine the HDI design type by defining the number and location of HDI layers that may or may not be combined with a substrate.
Type I, Standard build-up for HDI
This construction describes an HDI in which there are both blind vias and through vias used for interconnection. Type I constructions describe the fabrication of a single blind via layer on either one or both sides of an PCB substrate core.
The PCB substrate is typically manufactured using conventional PCB techniques and laser via hole technology. The substrate can have as few as one circuit layer or may be as complex as any number of inner layers.
Type II, Sequential build-up 1+N+1
Tipe II is characterized by buried vias in the core and may have through vias through the outer layers. Type II constructions describe an HDI board in which there are plated microvias, plated buried vias and may have PTHs used for surface-to-surface interconnection.
Microvias on layer 1 and layer n grant the connection to conductors on layer 2 and layer n-1, making the connection with the core. Type II constructions can also have PTH to connect layer 1 directly to layer n.
Struttura Tipo III, build-up sequenziale X+N+X
Type III constructions describe an HDI in which there are plated microvias, paste/resin filled holes and through vias used for interconnection. Type III constructions are distinguished by having at least two microvia layers on at least one side of a substrate core. The substrate core is usually manufactured using conventional PCB techniques, may be rigid or flexible, and have as few as one or as many as any number of layers with buried vias.
Where space is minimal and if expressly requested, stacked vias - stacked blind holes - must be used - while where conditions allow it, staggered vias - non-overlapping blind holes on several levels - can be used. Staggered vias are less critical, so preferable, for manufacturing than stacked vias.
For more details, call us +39 059 269711 or send an e-mail email@example.com
mar 31 2021
Dato: 31. marts 2021 11:51
The capped vias technology with hole filling with resin aims to increase the density of the interconnections in printed circuit boards by using the space occupied by through holes as SMD assembly points. This technique consists in filling the holes after plating them, with copper thicknesses on the walls, normally >25µm, and, in any case, defined with the customer.
The resins adopted for "filled and capped vias” have specific insulation properties and dimensional variation with temperatures, they are treated with heat for the relative polymerization and consequent hardening, and, subsequently, are first planarized and then covered with a layer of copper with a thickness of at least 15µm.
This technique can be applied for the realization of different types of printed circuits and with multiple application variants which for this reason are in strong expansion:
- pads used for µBGA, "ball on via technology" and SMD assembly: "Via in Pad Assembly Technology"
- pads used as test points, "Via in Pad Test Technology”
- heat dissipation pads under the cases of the components for "heat management”
- SBU - sequential build up" construction with laser stacked holes on buried holes treated as capped vias
The fundamental operations for filling the holes with resin are carried out in two distinct phases: in the first, the holes are filled with variable pressure and vacuum to allow perfect filling of the holes without the risk of gaps in the resin, while, in the second phase, a surface cleaning of the panel is performed to eliminate the excess resin, facilitating its subsequent planarization.
Whatever the final technology chosen, after complete polymerization, the resin is removed by a mechanical brushing action, called planarization, which can be performed with specific machines that work with cup brushes or with horizontal brushing machines.
The target is to remove the excess resin and create a uniform surface: this operation is a prerequisite for the subsequent over-plating of the filled vias with copper to allow ideal soldering of electronic components. (inserisci disegno).
The knowledge of "capped vias" technology is fundamental today to create compliant pcbs to market and regulations standards required, especially relating to the growing HDI technology demand.
feb 25 2021
Dato: 25. februar 2021 16:08
This trend is imposed by the market demand for increasingly portable devices, therefore of low weight, and capable of integrating many functions: the real challenge is to reduce the size of the devices, miniaturizing them, and, at the same time, to increase their performance.
The target can be reached basically by working on the structure of the printed circuit board by increasing the density of the components on the surface and the number of connections between the layers that make it up: this need has therefore led to the birth and diffusion of " HDI - High Density Interconnection" structures.
All circuits with pitches’ density per surface with values greater than 20 pitches/cm² greater than traditional printed circuit boards (PCBs) are defined as high interconnection density PCBs (HDI). This therefore results in smaller size for design parameters such as tracks less than 100 ?m/4mils wide, laser holes with a diameter less than 150 ?m/6mils and pitches with a diameter less than 400 ?m/16mils.
feb 17 2021
Dato: 17. februar 2021 12:13
Herunder varetager Carl C opgaver som:
- Fundaments design
- Støbning og jording af fundament
I januar 2021 har vi rejst to master i henholdsvis Ravnstrup og Skanderborg. På disse sites stod Carl C for den geotekniske undersøgelse, etablering af fundament, produktion og montage af 48m Serie 16 gittermaster.
Efter den geotekniske rapport er færdiggjort, bliver fundamentet beregnet, således at det passer præcist til den bestemte site og jordbund. Også mastetypen bliver bestemt for hver site, så den egner sig bedst til området, opgaven og vindforhold.
Mange flere sites er allerede planlagt og udrulningen af det danske 5G-netværk bliver en meget interessant rejse, som Carl C ser frem til at være en del af.
feb 17 2021
Dato: 17. februar 2021 12:09
Gitterbroen er til brug for kædetransportør til stigende transport med gangbro og gelænder på den ene side.
Gitterbroen er opbygget i 3 moduler fremstillet med stor præcision i en kraftig galvaniseret udførelse, hvorved den er let at samle og installere.
Gitterbroen er designet i tæt samarbejde med kunden for at opnå den rigtige konstruktion som passer præcist til deres projekt.
feb 9 2021
Dato: 9. februar 2021 07:52
In particular, we have highlighted that the moisture absorbed by the base material can generate delamination during the assembly of PCBs.
With this second article, relating to the risks generated on PCBs by the presence of humidity, we deepen the subject and deal, in particular, with the impact of humidity on the Tg of the base materials and the consequences on the quality of PCBs and PCBAs.
The Tg of a polymeric material (laminates and pre-impregnates are partially made of resin) represents the temperature value at which the glass transition begins which we could define as the temperature at which the resin changes its mechanical characteristics starting to soften: for this reason it is important to choose the base material in relation to the expected conditions of use of each PCB.
To read all the article, click here